• DocumentCode
    759636
  • Title

    Charge trap generation in LPCVD oxides under high field stressing

  • Author

    Bhat, Navakanta ; Apte, Pushkar P. ; Saraswat, Krishna C.

  • Author_Institution
    Dept. of Electr. Eng., Stanford Univ., CA, USA
  • Volume
    43
  • Issue
    4
  • fYear
    1996
  • fDate
    4/1/1996 12:00:00 AM
  • Firstpage
    554
  • Lastpage
    560
  • Abstract
    The degradation of low pressure chemical vapor deposited (LPCVD) oxides, prepared using silane and tetra ethyl ortho silicate (TEOS) as the source, has been investigated under high field stressing. The LPCVD oxides exhibit enhanced conductivity for the Fowler-Nordheim tunneling current, which is modeled as an effective lowering of potential barrier at the injecting electrode. The charge to breakdown (Qbd) of LPCVD oxides depends on both the deposition chemistry and post deposition annealing condition. The change in interface-state density (ΔDit), flatband voltage (ΔVfb), and gate voltage (Δ|Vg|) during constant current stressing are studied to identify the degradation mechanism. We see a very good correlation between Qbd and Δ|Vg|, indicating that the degradation in LPCVD oxides is dominated by bulk trap generation and subsequent charge trapping. We present a detailed theoretical analysis to substantiate this
  • Keywords
    CVD coatings; MOS capacitors; annealing; electric breakdown; high field effects; insulating thin films; interface states; semiconductor device reliability; tunnelling; 400 C; 650 C; Fowler-Nordheim tunneling current; LPCVD oxides; MOS capacitors; Si; SiH4; SiO2-Si; bulk trap generation; charge to breakdown; charge trap generation; constant current stressing; degradation mechanism; deposition chemistry; enhanced conductivity; flatband voltage; gate voltage; high field stressing; interface-state density; low pressure chemical vapor deposition; p-Si substrate; post deposition annealing; potential barrier lowering; silane; tetra ethyl ortho silicate; Annealing; Argon; Chemicals; Chemistry; Conductivity; Degradation; Dielectric thin films; Electric breakdown; Electrodes; Temperature; Thermal degradation; Thin film transistors; Tunneling; Very large scale integration; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.485537
  • Filename
    485537