DocumentCode
759781
Title
Design of Components and Circuits Underneath Integrated Inductors
Author
Zhang, Frank ; Kinget, Peter R.
Author_Institution
Dept. of Electr. Eng., Columbia Univ., New York, NY
Volume
41
Issue
10
fYear
2006
Firstpage
2265
Lastpage
2271
Abstract
In this paper, we present a study of the eddy current effect of devices placed underneath and inside an on-chip inductor. We verified the performance of such area-saving structures through electromagnetic (EM) simulations and measurement of test structures. We used layout techniques to minimize eddy current loss and magnetic coupling between the devices and the inductor, and constructed a complete voltage-controlled oscillator (VCO) inside an inductor. Measurement results show that this compact VCO has an equal performance in phase noise and output power as compared to a traditional VCO while reducing the area by about 50%. The techniques presented in this paper are general and can be implemented in most layouts without extra post-processing steps
Keywords
eddy currents; inductors; integrated circuit layout; radiofrequency integrated circuits; voltage-controlled oscillators; eddy current effect; eddy current loss; electromagnetic simulations; integrated inductors; magnetic coupling; on-chip inductor; phase noise; radiofrequency integrated circuits; voltage-controlled oscillator; Area measurement; Circuit simulation; Circuit testing; Eddy currents; Electromagnetic measurements; Inductors; Integrated circuit measurements; Magnetic devices; Magnetic losses; Voltage-controlled oscillators; Eddy current; layout; metal fill; radio frequency integrated circuits (RFIC); voltage-controlled oscillator (VCO);
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/JSSC.2006.881547
Filename
1703681
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