• DocumentCode
    760118
  • Title

    Determination of charge density and charge centroid location in electrets with semiconducting substrates

  • Author

    Günther, Peter

  • Author_Institution
    Tech. Univ. of Darmstadt, Germany
  • Volume
    27
  • Issue
    4
  • fYear
    1992
  • fDate
    8/1/1992 12:00:00 AM
  • Firstpage
    698
  • Lastpage
    701
  • Abstract
    A method for determining the amount and the mean spatial depth of charge in electret-semiconductor systems is presented. It consists of two nondestructive measurements, from which the internal and external electric fields can be calculated independently. First, the surface potential at the electret-air interface is measured by an electrostatic voltmeter. Second, using a contacting front electrode, a metal-insulator-semiconductor structure is formed, on which capacitance or conductance voltage measurements are carried out. With these results, one obtains the surface potential at the electret-semiconductor interface. The charge centroid and the charge density can now be calculated. For SiO2-silicon structures, where the 1-μm-thick thermally wet-grown SiO2 layer acts as an electret, it was found that the charge centroid can be influenced strongly by temperature treatment prior to charging
  • Keywords
    electrets; elemental semiconductors; metal-insulator-semiconductor structures; silicon; silicon compounds; surface potential; SiO2-Si; capacitance measurement; charge centroid location; charge density; conductance voltage measurements; electret-air interface; electret-semiconductor interface; electrets; electric fields; electrostatic voltmeter; metal-insulator-semiconductor structure; nondestructive measurements; semiconducting substrates; surface potential; temperature treatment; Air gaps; Current measurement; Dielectrics and electrical insulation; Electrets; Electric variables measurement; Electrodes; Electrostatic measurements; Semiconductivity; Substrates; Voltmeters;
  • fLanguage
    English
  • Journal_Title
    Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9367
  • Type

    jour

  • DOI
    10.1109/14.155785
  • Filename
    155785