Silicon subminiature microphones with organic piezoelectric layers-fabrication and acoustical behavior

Author

Schellin, Ralf ; Hess, G. ; Kuehnel, W. ; Sessler, G.M. ; Fukada, E.

Author_Institution

Inst. for Electroacoustics, Tech. Univ., Darmstadt, Germany

Volume

27

Issue

4

fYear

1992

Firstpage

867

Lastpage

871

Abstract

A silicon subminiature microphone, based on the piezoelectric effect of organic films such as aromatic polyurea, PVDF, and PVDF/TrFE, is proposed. The acoustical sensor is fabricated using a slightly modified integrated circuit technology process and a standard micromechanical fabrication procedure. The main production steps of this hybrid sensor are given, including the fabrication of the mechanical part of the sensor, the deposition or spin coating of the films, and the poling of the polymer layers. Measurements of the transverse piezoelectric charge constant d₃₁ yield values up to >

Keywords

micromechanical devices; microphones; piezoelectric devices; piezoelectric materials; polymer films; silicon; PVDF; PVDF/TrFE; Si microphones; acoustical behavior; aromatic polyurea; fabrication; film spin coating; hybrid sensor; micromechanical fabrication procedure; modified integrated circuit technology process; piezoelectric organic films; polymer layer poling; production steps; sound sensitivity; subminiature microphone; transverse piezoelectric charge constant; Acoustic measurements; Acoustic sensors; Fabrication; Mechanical sensors; Microphones; Piezoelectric effect; Piezoelectric films; Polymer films; Semiconductor films; Silicon;

fLanguage

English

Journal_Title

Electrical Insulation, IEEE Transactions on

Publisher

ieee

ISSN

0018-9367

Type

jour

DOI

10.1109/14.155812

Filename

155812