DocumentCode :
7616
Title :
Post-Irradiation-Gate-Stress on Power MOSFETs: Quantification of Latent Defects-Induced Reliability Degradation
Author :
Privat, A. ; Touboul, A.D. ; Michez, A. ; Bourdarie, S. ; Vaille, J.R. ; Wrobel, F. ; Arinero, R. ; Chatry, N. ; Chaumont, G. ; Lorfevre, E. ; Saigne, F.
Author_Institution :
Univ. Montpellier 2, Montpellier, France
Volume :
60
Issue :
6
fYear :
2013
fDate :
Dec. 2013
Firstpage :
4166
Lastpage :
4174
Abstract :
Electrical characterizations are used to understand power MOSFETs failure mechanisms after heavy ion irradiation. Results indicate that both bias levels and impact localization of heavy ion are important parameters for SEGR triggering or latent defect formation. This work addresses the limits of the post-irradiation gate stress relevance used for Power MOSFETs space qualification.
Keywords :
failure analysis; power MOSFET; radiation hardening (electronics); semiconductor device reliability; SEGR triggering; electrical characterizations; heavy ion impact localization; latent defect formation; latent defects-induced reliability degradation quantification; post-irradiation gate stress; post-irradiation-gate-stress; power MOSFET failure mechanisms; power MOSFET space qualification; Degradation; Electric breakdown; Electric fields; MOSFET; Radiation effects; Reliability; Heavy ion; SEGR; latent defect; post-irradiation-gate-stress; power MOSFET; reliability;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/TNS.2013.2287974
Filename :
6678308
Link To Document :
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