Title :
Design Methodology for Global Resonant H-Tree Clock Distribution Networks
Author :
Rosenfeld, Jonathan ; Friedman, Eby G.
Author_Institution :
Dept. of Electr. & Comput. Eng., Rochester Univ., NY
Abstract :
Design guidelines for resonant H-tree clock distribution networks are presented in this paper. A distributed model of a two-level resonant H-tree structure is described, supporting the design of low power, skew, and jitter resonant H-tree clock distribution networks. Excellent agreement is shown between the proposed model and SpectraS simulations. A case study is presented that demonstrates the design of a two-level resonant H-tree network, distributing a 5-GHz clock signal in a 0.18-mum CMOS technology. This example exhibits an 84% decrease in power dissipation as compared to a standard H-tree clock distribution network. The design methodology enables tradeoffs among design variables to be examined, such as the operating frequency, the size of the on-chip inductors and capacitors, the output resistance of the driving buffer, and the interconnect width. A sensitivity analysis of resonant H-tree clock distribution networks is also provided. The effect of the driving buffer output resistance, on-chip inductor and capacitor size, and signal and shielding transmission line width and spacing on the output voltage swing and power consumption is described
Keywords :
capacitors; clocks; inductors; jitter; logic design; low-power electronics; trees (mathematics); 0.18 micron; 5 GHz; CMOS technology; SpectraS simulations; distributed model; driving buffer; global resonant H-tree clock distribution networks; interconnect width; on-chip capacitors; on-chip inductors; sensitivity analysis; shielding transmission line; signal transmission line; CMOS technology; Capacitors; Clocks; Design methodology; Guidelines; Inductors; Jitter; Resonance; Semiconductor device modeling; Signal design; H-tree sector; on-chip inductors and capacitors; resonant clock distribution networks; sensitivity;
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
DOI :
10.1109/TVLSI.2007.893576