Sensitivity analysis of critical parameters in board test

Author

Tegethoff, Mick M V ; Chen, Tom W.

Author_Institution

Manuf. Test Div., Hewlett-Packard Co., Loveland, CO, USA

Volume

13

Issue

1

fYear

1996

Firstpage

58

Lastpage

63

Abstract

The authors analyze the main contributors to the quality and cost of complex boards. With manufacturing data from Hewlett-Packard boards, they use simulation models to derive the sensitivity of quality and cost to the solder defect rate, the functional defect rate, and test coverage. They also give a simple cost estimate of implementing IEEE 1149.1 boundary scan on ASICs. Their new yield model, which accounts for solder defect clustering, provides highly accurate yield predictions

Keywords

CAD; printed circuit testing; printed circuits; sensitivity analysis; ASICs; Hewlett-Packard boards; board test; complex boards; cost estimate; critical parameters; functional defect rate; sensitivity; simulation models; solder defect clustering; solder defect rate; test coverage; yield model; yield predictions; Analytical models; Assembly; Circuit testing; Computational modeling; Computer simulation; Cost function; Manufacturing processes; Sensitivity analysis; Surface-mount technology; Virtual manufacturing;

fLanguage

English

Journal_Title

Design & Test of Computers, IEEE

Publisher

ieee

ISSN

0740-7475

Type

jour

DOI

10.1109/54.485783

Filename

485783