DocumentCode
762415
Title
Evaluating the Yield of Repairable SRAMs for ATE
Author
Ottavi, Marco ; Schiano, Luca ; Wang, Xiaopeng ; Kim, Yong-Bin ; Meyer, Fred J. ; Lombardi, Fabrizio
Author_Institution
Electr. & Comput. Eng. Dept., Northeastern Univ., Boston, MA
Volume
55
Issue
5
fYear
2006
Firstpage
1704
Lastpage
1712
Abstract
An accurate yield evaluation is essential in selecting redundancy allocation and testing strategies for memories. Yield evaluation can resolve the many issues revolving around cost-effective built-in self-test (BIST) and automatic test equipment (ATE)-based solutions for a higher test transparency. In this paper, two yield-calculation methodologies for SRAM arrays are proposed. General yield expressions for VLSI chips are initially presented. The regular and repetitive structure of an SRAM array is exploited, and substantial yield improvements can be achieved by the introduction of redundancy. Two repair yield-evaluation methods for one-dimensional redundant memory arrays are introduced and compared for ATE application. The first method is based on the sum of the probabilities of all repairable fault patterns; the second method is based on Markov modeling. Using industrial data, it is shown that these methods are applicable to ATE usage under different conditions of defect rate in the possible defects. Different features of the proposed methods are discussed
Keywords
Markov processes; SRAM chips; automatic test equipment; automatic test pattern generation; built-in self test; integrated circuit yield; redundancy; Markov modeling; SRAM; VLSI chips; automatic test equipment; built-in self-test; fault patterns; memory arrays; redundancy; repair yield-evaluation methods; Automatic test equipment; Automatic testing; Built-in self-test; Costs; Manufacturing; Production; Random access memory; Redundancy; Statistics; Yield estimation; Automatic test equipment (ATE); Markov modeling; SRAM; manufacturing; redundancy; yield;
fLanguage
English
Journal_Title
Instrumentation and Measurement, IEEE Transactions on
Publisher
ieee
ISSN
0018-9456
Type
jour
DOI
10.1109/TIM.2006.880315
Filename
1703920
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