Title :
Modeling of SiC IGBT Turn-Off Behavior Valid for Over 5-kV Circuit Simulation
Author :
Miyake, M. ; Ueno, Masahiro ; Feldmann, Uwe ; Mattausch, Hans Jurgen
Author_Institution :
Hiroshima Univ., Higashi-Hiroshima, Japan
Abstract :
This paper presents a compact model of SiC insulated-gate bipolar transistors (IGBTs) for power electronic circuit simulation. Here, we focus on the modeling of important specific features in the turn-off characteristics of the 4H-SiC IGBT, which are investigated with a 2-D device simulator, at supply voltages higher than 5 kV. These features are found to originate from the punch-through effect of the SiC IGBT. Thus, they are modeled based on the carrier distribution change caused by punch through and implemented into the silicon IGBT model named “HiSIM-IGBT” to obtain a practically useful SiC-IGBT model. The developed compact SiC-IGBT model for circuit simulation is verified with the 2-D device simulation data.
Keywords :
circuit simulation; insulated gate bipolar transistors; power bipolar transistors; semiconductor device models; silicon compounds; wide band gap semiconductors; 2D device simulation data; 2D device simulator; HiSIM-IGBT; IGBT turn-off behavior modelling; SiC; carrier distribution; insulated-gate bipolar transistors; power electronic circuit simulation; punch-through effect; silicon IGBT model; Charge carrier density; Insulated gate bipolar transistors; Integrated circuit modeling; Mathematical model; Semiconductor device modeling; Silicon; Silicon carbide; Circuit simulation; HiSIM; IGBT; SPICE; SiC; compact model; punch through;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2012.2226182