Packaging of an integrated planar power passive module for a power electronics converter: a 1 MHz case study

Author

Strydom, Johan Tjeerd ; Van Wyk, Jacobus Daniel ; Campbell, Colin K. ; Ferreira, Jan Abraham ; Holm, Max Frederich Karl

Author_Institution

Energy Lab., Rand Afrikaans Univ., Johannesburg, South Africa

Volume

25

Issue

2

fYear

2002

fDate

6/1/2002 12:00:00 AM

Firstpage

260

Lastpage

265

Abstract

Planar ferromagnetic and ceramic dielectric passive component-packaging technology can provide cost-effectiveness in the production of compact, efficient, structures for use in integrated power electronic modules operating at kW power levels. This paper describes the design of an innovative integrated planar passive module for use in a power electronic converter, for the transmission of 1 kW at 1 MHz. Here, the planar inductance in the design employed high-permeability (μ_r≈1800) commercial type 3F3 ferrite E-core material. The planar constituent dielectric incorporated ceramic substrates of modified ferroelectric barium titanate (BaTiO₃), with relative permittivity ε_r≈200. As described, this passive structure had an experimental power-handling capability of 1 kW (1.7 kVA), with a power density of 132 W/in³ (8 W/cm³) and operating efficiency of 87%

Keywords

modules; packaging; power convertors; 1 MHz; 1 kW; 1.7 kVA; 3F3 ferrite E-core; 87 percent; BaTiO₃; ceramic dielectric substrate; ferroelectric barium titanate; inductance; integrated planar power passive module; packaging technology; permeability; permittivity; power electronics converter; Barium; Ceramics; Dielectric materials; Dielectric substrates; Electronics packaging; Ferrites; Ferroelectric materials; Inductance; Power electronics; Production;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2002.1010015

Filename

1010015