Packaging of an integrated planar power passive module for a power electronics converter: a 1 MHz case study

Planar ferromagnetic and ceramic dielectric passive component-packaging technology can provide cost-effectiveness in the production of compact, efficient, structures for use in integrated power electronic modules operating at kW power levels. This paper describes the design of an innovative integrated planar passive module for use in a power electronic converter, for the transmission of 1 kW at 1 MHz. Here, the planar inductance in the design employed high-permeability (μ_r≈1800) commercial type 3F3 ferrite E-core material. The planar constituent dielectric incorporated ceramic substrates of modified ferroelectric barium titanate (BaTiO₃), with relative permittivity ε_r≈200. As described, this passive structure had an experimental power-handling capability of 1 kW (1.7 kVA), with a power density of 132 W/in³ (8 W/cm³ ) and operating efficiency of 87%