DocumentCode
763271
Title
Heat sinks with fluted and wavy plate fins in natural and low-velocity forced convection
Author
Sikka, Kamal K. ; Torrance, Kenneth E. ; Scholler, C.U. ; Salanova, P.I.
Author_Institution
Sibley Sch. of Mech. & Aerosp. Eng., Cornell Univ., Ithaca, NY, USA
Volume
25
Issue
2
fYear
2002
fDate
6/1/2002 12:00:00 AM
Firstpage
283
Lastpage
292
Abstract
The effect on heat transfer of geometrically rearranging the surface area of a finned heat sink is investigated. Novel heat sinks with fluted and wavy plate fin configurations are designed and fabricated together with conventional longitudinal-plate and pin fin heat sinks. The experimental apparatus, consisting of the guard heater assembly, isolation chamber, wind tunnel, and data acquisition instrumentation, is described. The thermal performance of the novel and conventional heat sinks is measured and compared for the horizontal and vertical base plate orientations under natural and low-velocity forced convection conditions. Results, presented as the Nusselt number against the Rayleigh or Reynolds numbers, reveal that the pin fin heat sink generally outperforms the other heat sinks, when the heat sink surface area is held constant. A significant effect on heat transfer of the orientation of the forced flow with respect to the buoyancy flow is observed. Overall, the novel heat sink designs do not yield significantly better thermal performance than an optimized conventional longitudinal-plate heat sink
Keywords
forced convection; heat sinks; natural convection; Nusselt number; Rayleigh number; Reynolds number; buoyancy flow; data acquisition instrumentation; fluted fin; forced convection; guard heater assembly; heat sink; heat transfer; isolation chamber; longitudinal plate; natural convection; pin fin; surface area; thermal characteristics; wavy plate fin; wind tunnel; Aerospace engineering; Assembly; Data acquisition; Electronics packaging; Heat sinks; Heat transfer; Instruments; Pins; Shape; Thermal conductivity;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2002.1010019
Filename
1010019
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