DocumentCode
763937
Title
Reliability comparisons for plastic-encapsulated microcircuits
Author
Baker, Brett ; Martin, Steve
Author_Institution
Texas Instrum. Inc., Sherman, TX, USA
Volume
44
Issue
1
fYear
1995
fDate
3/1/1995 12:00:00 AM
Firstpage
6
Lastpage
7
Abstract
This paper briefly compares reliability test data obtained from plastic encapsulated microcircuits (PEM) purchased from various manufacturers. Tests include biased humidity, temperature cycling, autoclave, and life tests. The results indicate differences in reliability associated with PEM from the various manufacturers. These data highlight the need for a thorough understanding of supplier quality and reliability
Keywords
circuit reliability; encapsulation; integrated circuit testing; integrated circuits; life testing; polymers; autoclave tests; biased humidity testing; life tests; plastic-encapsulated microcircuits; quality; reliability test data; temperature cycling tests; CMOS logic circuits; CMOS technology; Humidity; Instruments; Life testing; Logic devices; Logic testing; Plastics; Power system reliability; System testing;
fLanguage
English
Journal_Title
Reliability, IEEE Transactions on
Publisher
ieee
ISSN
0018-9529
Type
jour
DOI
10.1109/24.376511
Filename
376511
Link To Document