Title :
Reliability comparisons for plastic-encapsulated microcircuits
Author :
Baker, Brett ; Martin, Steve
Author_Institution :
Texas Instrum. Inc., Sherman, TX, USA
fDate :
3/1/1995 12:00:00 AM
Abstract :
This paper briefly compares reliability test data obtained from plastic encapsulated microcircuits (PEM) purchased from various manufacturers. Tests include biased humidity, temperature cycling, autoclave, and life tests. The results indicate differences in reliability associated with PEM from the various manufacturers. These data highlight the need for a thorough understanding of supplier quality and reliability
Keywords :
circuit reliability; encapsulation; integrated circuit testing; integrated circuits; life testing; polymers; autoclave tests; biased humidity testing; life tests; plastic-encapsulated microcircuits; quality; reliability test data; temperature cycling tests; CMOS logic circuits; CMOS technology; Humidity; Instruments; Life testing; Logic devices; Logic testing; Plastics; Power system reliability; System testing;
Journal_Title :
Reliability, IEEE Transactions on
