Title :
An optical backplane demonstrator system based on FET-SEED smart pixel arrays and diffractive lenslet arrays
Author :
Plant, D.V. ; Robertson, B. ; Hinton, H.S. ; Robertson, W.M. ; Boisset, G.C. ; Kim, N.H. ; Liu, Y.S. ; Otazo, M.R. ; Rolston, D.R. ; Shang, A.Z.
Author_Institution :
Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
Abstract :
We have demonstrated a representative portion of an optical backplane using FET-SEED smart pixels and free-space optics to interconnect printed circuit boards (PCB´s) in a two board, unidirectional link configuration. 4/spl times/4 arrays of FET-SEED transceivers were designed, fabricated, and packaged all the PCB level, The optical interconnection was constructed using diffractive microoptics, and custom optomechanics. The system was operated in two modes, one showing high data throughput, 100 MBit/sec, and the other demonstrating large connection densities, 2222 channel/cm/sup 2/.<>
Keywords :
SEEDs; asynchronous transfer mode; field effect integrated circuits; integrated optoelectronics; optical computing; optical interconnections; optical receivers; photonic switching systems; printed circuits; smart pixels; transceivers; 100 Mbit/s; 4/spl times/4 arrays; FET-SEED smart pixel arrays; FET-SEED transceivers; PCB level; custom optomechanics; design; diffractive microoptics; fabrication; free-space optics; high data throughput; large connection densities; optical backplane; optical backplane demonstrator system; optical interconnection; package; printed circuit boards; unidirectional link configuration; Backplanes; Integrated circuit interconnections; Optical arrays; Optical design; Optical diffraction; Optical interconnections; Packaging; Printed circuits; Smart pixels; Transceivers;
Journal_Title :
Photonics Technology Letters, IEEE
