• DocumentCode
    766548
  • Title

    High-reliability, high-performance RF micromachined switch using liquid metal

  • Author

    Kondoh, You ; Takenaka, Tsutomu ; Hidaka, Tetsuya ; Tejima, Go ; Kaneko, Yasuhisa ; Saitoh, Mitsuchika

  • Author_Institution
    Agilent Technol. Japan Ltd., Tokyo, Japan
  • Volume
    14
  • Issue
    2
  • fYear
    2005
  • fDate
    4/1/2005 12:00:00 AM
  • Firstpage
    214
  • Lastpage
    220
  • Abstract
    Existing mechanical relays have reliability-related issues including unstable contact resistance and limited cycle life. These problems are caused by mechanical fatigue and wearing of the contact surfaces. In the liquid metal micro switch (LiMMS), we employ a liquid-liquid contact to address these issues. The switching operation is achieved by forming a gap in the liquid metal using gas expansion. Our prototype has a microchannel on a glass substrate to hold a tiny amount of mercury, 0.15 mm in width and 0.1 mm in height, and TaN thin-film heaters on a ceramic substrate to expand the operating gas by heating. The substrates are bonded together and the total size of the device is 5×5×1.4 mm. We successfully demonstrated 70-mΩ on-resistance, 1 ms-switching speed, the ability to handle up to 1 A of dc current and over 1×108 cycle operation. LiMMS also has good RF performance, better than 1 dB insertion loss, and better than 20 dB isolation up to 18 GHz.
  • Keywords
    heating; liquid metals; micromachining; microrelays; microswitches; tantalum compounds; 0.10 mm; 0.15 mm; 1 A; 18 GHz; 1E-3 s; 70 muohm; Hg; RF micromachined switch; TaN; TaN thin-film heaters; ceramic substrate; contact surface wear; gas expansion; glass substrate; high-reliability; limited cycle life; liquid metal micro switch; liquid-liquid contact; mechanical fatigue; mechanical relays; microchannel; unstable contact resistance; Contact resistance; Fatigue; Glass; Microchannel; Prototypes; Radio frequency; Relays; Substrates; Surface resistance; Switches;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2004.839604
  • Filename
    1416898