DocumentCode
766570
Title
Evidence for bulk trap generation during NBTI phenomenon in pMOSFETs with ultrathin SiON gate dielectrics
Author
Tsujikawa, Shimpei ; Yugami, Jiro
Author_Institution
Renesas Technol. Corp., Hyogo, Japan
Volume
53
Issue
1
fYear
2006
Firstpage
51
Lastpage
55
Abstract
Negative bias temperature instability (NBTI) of pMOSFETs with direct-tunneling SiON gate dielectrics was studied in detail. By investigating the effects of applying positive gate bias on pMOSFETs after exposure to NBT stress, the generation of bulk charge traps in the gate dielectrics during NBTI was clearly demonstrated. In particular, it was found that a positive charge generated by negative bias temperature stress (NBT stress) can be neutralized and that the neutralized site can return to the positive state. We consider that the bulk trap is due to hydrogen atoms released from the interface between the SiON gate dielectric and the Si substrate (and this is what has conventionally been considered a positive fixed charge). Moreover, the bulk trap generation was shown to give rise to stress-induced leakage current.
Keywords
MOSFET; interface states; leakage currents; silicon compounds; NBTI phenomenon; SiON; bulk charge traps; bulk trap generation; direct-tunneling gate dielectrics; hydrogen atoms; interface trap; negative bias temperature instability; negative bias temperature stress; pMOSFET; stress-induced leakage current; time-dependent dielectric breakdown; ultrathin gate dielectrics; Dielectric substrates; Electron traps; Hydrogen; Leakage current; MOSFETs; Niobium compounds; Stress; Temperature; Titanium compounds; Voltage; Bulk trap; interface trap; negative bias temperature instability (NBTI); pMOS; recovery; stress-induced leakage current (SILC); thin gate dielectric; time-dependant dielectric breakdown (TDDB);
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2005.860653
Filename
1561545
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