EMC Computer Modeling Techniques for CPU Heat Sink Simulation

Author

Lu, Junwei ; Dawson, Francis

Author_Institution

Fac. of EIT, Griffith Univ., Brisbane, Qld.

Volume

42

Issue

10

fYear

2006

Firstpage

3171

Lastpage

3173

Abstract

This paper presents finite-element frequency domain results for electromagnetic radiation emitted from high power microelectronic circuits connected to a heat sink. The heat sink model associated with one of the IEEE EMC challenging problems has been used to investigate three different grounding configurations. A new simulation model for the Intel P4 CPU heat sink is proposed and analyzed. A resonant frequency of 2.6 GHz with a reflection coefficient of 8.3 dB was found for the CPU heat sink. This is close to the IEEE and Bluetooth wireless communication system´s operating frequency of 2.4 GHz. An optimal design of the CPU heat sink design should be performed in order to minimize the radiated emission from the CPU heat sink

Keywords

electromagnetic compatibility; finite element analysis; frequency-domain analysis; heat sinks; microprocessor chips; 2.6 GHz; CPU heat sink; EMC; electromagnetic radiation; grounding configurations; high power microelectronic circuits; Central Processing Unit; Circuit simulation; Computational modeling; Computer simulation; Electromagnetic compatibility; Electromagnetic radiation; Finite element methods; Frequency domain analysis; Heat sinks; Microelectronics; CPU heat sink; EMC; EMC challenging problem; EMC computer modeling; EMI;

fLanguage

English

Journal_Title

Magnetics, IEEE Transactions on

Publisher

ieee

ISSN

0018-9464

Type

jour

DOI

10.1109/TMAG.2006.880092

Filename

1704563