Title :
Bonding wires to quantized Hall resistors
Author_Institution :
Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
fDate :
4/1/1995 12:00:00 AM
Abstract :
Three different techniques for attaching wires to quantized Hall resistors with gold-germanium-nickel (AuGe/Ni) alloyed contacts were evaluated. The best quality and most robust samples were made by evaporating bonding pads that overlapped the alloyed contacts and the substrate, so that bonds could be made over the substrate rather than over the heterostructure
Keywords :
electric resistance measurement; electrical contacts; germanium alloys; gold alloys; measurement standards; nickel alloys; quantum Hall effect; resistors; soldering; AuGe-Ni; AuGe/Ni alloyed contacts; GaAs-AlGaAs; alloyed contacts; bonding pads; bonding wires; evaporation; heterostructure; quantized Hall resistors; resistance standards; soldering; Bonding; Contacts; Cryogenics; Gallium arsenide; Gold alloys; Joining processes; Nickel alloys; Resistors; Temperature; Wires;
Journal_Title :
Instrumentation and Measurement, IEEE Transactions on
