DocumentCode :
766750
Title :
Release processing effects on laser repair of stiction-failed microcantilevers
Author :
Koppaka, Sai B. ; Phinney, Leslie M.
Author_Institution :
Dept. of Mech. & Ind. Eng., Univ. of Illinois, Urbana, IL, USA
Volume :
14
Issue :
2
fYear :
2005
fDate :
4/1/2005 12:00:00 AM
Firstpage :
410
Lastpage :
418
Abstract :
Undesirable adhesion in microelectromechanical systems (MEMS) is referred to as stiction and is a principal failure mechanism in surface-micromachined MEMS devices. Previous investigations demonstrated repairing stiction-failed polycrystalline silicon MEMS structures released from isopropyl alcohol (IPA) using Nd:YAG laser irradiation and predicting the laser repair process using a thermomechanical model. The current paper reports the effectiveness of the laser repair process and corresponding thermomechanical model predictions for microcantilevers that have failed during four release treatments: water, IPA, octadecyltrichlorosilane (OTS), and supercritical CO2 drying. Model predictions and experimental measurements of the laser repair process are also provided for MEMS devices that failed due to contact during electrostatic actuation. The results indicate that the laser repair process is very effective for both failure modes and that the thermomechanical model predicts the laser repair of microcantilevers that failed during release much better than for microcantilevers that failed due to subsequent contact.
Keywords :
adhesion; laser beam machining; micromechanical devices; stiction; thermomechanical treatment; CO2; Nd:YAG laser irradiation; adhesion; electrostatic actuation; laser repair process; microcantilevers; microelectromechanical systems; release processing effects; stiction failure; supercritical CO2 drying; surface-micromachined MEMS devices; thermomechanical model prediction; Adhesives; Electrostatic measurements; Failure analysis; Laser modes; Microelectromechanical devices; Microelectromechanical systems; Micromechanical devices; Predictive models; Silicon; Thermomechanical processes; Adhesion; laser repair; microcantilever; microelectromechanical systems (MEMS); release; stiction;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2004.839344
Filename :
1416917
Link To Document :
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