Wave model solution to the ground/power plane noise problem

Author

Lei, Guang-Tsai ; Techentin, Robert W. ; Hayes, Paul R. ; Schwab, Daniel J. ; Gilbert, Barry K.

Author_Institution

Dept. of Physiol. & Biophys., Mayo Med. Sch., Rochester, MN, USA

Volume

44

Issue

2

fYear

1995

fDate

4/1/1995 12:00:00 AM

Firstpage

300

Lastpage

303

Abstract

In this paper, we describe the development of a theoretical field-based or “wave” model which we are employing in an attempt to characterize the ground/power plane (e.g., the V_cc plane) structure of a printed wiring board (PWB) or multichip module (MCM). A brief development of the model is presented, followed by simulation results and insight into the noise phenomena. A test structure and electrical measurements are used to confirm the correctness and applicability of the model

Keywords

SPICE; circuit analysis computing; data analysis; electric impedance; equivalent circuits; lumped parameter networks; multichip modules; multiport networks; printed circuits; MCM; PWB; correctness; electrical measurements; ground/power plane noise problem; multichip module; noise; printed wiring board; simulation; test structure; wave model solution; Capacitance; Circuit noise; Clocks; Equivalent circuits; Frequency; Integrated circuit noise; Multichip modules; Power system modeling; Wiring; Working environment noise;

fLanguage

English

Journal_Title

Instrumentation and Measurement, IEEE Transactions on

Publisher

ieee

ISSN

0018-9456

Type

jour

DOI

10.1109/19.377836

Filename

377836