DocumentCode :
766979
Title :
Materials Selection and Design of Microelectrothermal Bimaterial Actuators
Author :
Prasanna, Srinivasan ; Spearing, S. Mark
Author_Institution :
Southampton Univ.
Volume :
16
Issue :
2
fYear :
2007
fDate :
4/1/2007 12:00:00 AM
Firstpage :
248
Lastpage :
259
Abstract :
A common form of MEMS actuator is a thermally actuated bimaterial, which is easy to fabricate by surface micromachining and permits out of plane actuation, which is otherwise difficult to achieve. This paper presents an analytical framework for the design of such microelectrothermal bimaterial actuators. Mechanics relationships for a cantilever bimaterial strip subjected to a uniform temperature were applied to obtain expressions for performance metrics for the actuator, i.e., maximum work/volume, blocked (force) moment, and free-end (displacement) slope. Results from finite-element analysis and closed form relations agree well to within 1%. The optimal performance for a given pair of materials and the corresponding thickness ratio were determined. Contours of equal performance corresponding to commonly used substrates (e.g., Si, SiO2) were plotted in the domain of governing material properties (thermal expansion coefficient and Young\´s modulus) to identify candidate materials for further development. These results and the accompanying methodology provide a rational basis for comparing the suitability of "standard" materials for microelectrothermal actuators, as well as identifying materials that might be suitable for further research
Keywords :
Young´s modulus; finite element analysis; microactuators; micromachining; thermal expansion; MEMS actuator; Young modulus; cantilever bimaterial strip; finite-element analysis; materials selection; mechanics relationships; microactuators; microelectrothermal bimaterial actuators; surface micromachining; thermal expansion coefficient; thermally actuated biomaterial; thermoelasticity; Actuators; CMOS technology; Electrothermal effects; Fabrication; Micromechanical devices; Semiconductor films; Semiconductor materials; Silicon; Thermal expansion; Thermal resistance; Microactuators; optimization; performance and thermoelasticity;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2006.889528
Filename :
4147600
Link To Document :
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