• DocumentCode
    767293
  • Title

    Junction Thermal Impedance Measurement of Superluminescent Diodes

  • Author

    Zhou, Sheng ; Zhang, Xiupu

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que.
  • Volume
    19
  • Issue
    9
  • fYear
    2007
  • fDate
    5/1/2007 12:00:00 AM
  • Firstpage
    683
  • Lastpage
    685
  • Abstract
    A new method is presented for junction thermal impedance measurement of superluminescent diodes. A few derivatives of mean wavelength, optical power, and voltage over temperature and current are used for the calculation. Carrier effect is removed. High accuracy is obtained by data regression on variables separately. Both analytical formula and experimental results are provided
  • Keywords
    superluminescent diodes; data regression; junction thermal impedance measurement; mean wavelength derivatives; superluminescent diodes; thermal impedance; Impedance measurement; Power generation; Pulse measurements; Semiconductor device measurement; Semiconductor device packaging; Stimulated emission; Superluminescent diodes; Temperature; Voltage; Wavelength measurement; Mean wavelength; measurement; superluminescent diodes (SLDs); thermal impedance;
  • fLanguage
    English
  • Journal_Title
    Photonics Technology Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1041-1135
  • Type

    jour

  • DOI
    10.1109/LPT.2007.895051
  • Filename
    4147633