• DocumentCode
    768035
  • Title

    A novel method of measuring microelectronic interconnect transmission line parameters and discontinuity equivalent electrical parameters using multiple reflections

  • Author

    Abernethy, Charles E. ; Cangellaris, Andreas C. ; Prince, John L.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
  • Volume
    19
  • Issue
    1
  • fYear
    1996
  • fDate
    2/1/1996 12:00:00 AM
  • Firstpage
    32
  • Lastpage
    39
  • Abstract
    This paper describes a novel technique which measures the electrical properties of transmission lines (such as microstrip) and extracts equivalent electrical parameters for discontinuities in transmission lines with remarkable precision using a modern network analyzer and newly developed de-embedding software. This technique has successfully measured the per-unit-length inductance (L´), resistance (R´), capacitance (C´), and dielectric loss conductance (G´) of microstrip transmission lines made from solid copper and conductive polymer. These materials have been studied at frequencies up to 201 MHz, and higher frequencies are possible. Discontinuities, such as an opening in the ground plane under the microstrip, have also been characterized at frequencies up to 2400 MHz. Measurements of characteristic impedances and skin resistances made by this method are in agreement with theoretical models. Higher frequency measurements should be feasible using a higher frequency network analyzer
  • Keywords
    equivalent circuits; high-frequency transmission line measurement; integrated circuit interconnections; integrated circuit measurement; microstrip discontinuities; microwave reflectometry; 201 MHz; 2400 MHz; Cu; capacitance; characteristic impedance; conductive polymer; de-embedding software; dielectric loss conductance; discontinuity equivalent electrical parameters; electrical properties; ground plane; inductance; measurement; microelectronic interconnects; microstrip; multiple reflections; network analyzer; resistance; skin resistance; solid copper; transmission line parameters; Dielectric loss measurement; Dielectric measurements; Electric variables measurement; Electrical resistance measurement; Frequency; Microelectronics; Microstrip; Transmission line discontinuities; Transmission line measurements; Transmission line theory;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9894
  • Type

    jour

  • DOI
    10.1109/96.486480
  • Filename
    486480