Time-domain characterization and circuit modeling of a multilayer ceramic package

Author

Jong, Jyh-Ming ; Janko, Bozidar ; Tripath, Vijai K.

Author_Institution

Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA

Volume

19

Issue

1

fYear

1996

fDate

2/1/1996 12:00:00 AM

Firstpage

48

Lastpage

56

Abstract

The dynamic deconvolution (peeling algorithm) used in the past for single interconnects is extended to multiple-coupled interconnects and used to model high-speed electronic packages. A multilayer ceramic package (MLC) is used as vehicle to demonstrate the characterization and equivalent circuit modeling procedure based on single and multiport time-domain measurement

Keywords

deconvolution; equivalent circuits; integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; multiport networks; time-domain analysis; dynamic deconvolution; equivalent circuit modeling; high-speed electronic package; multilayer ceramic package; multiple-coupled interconnects; multiport time-domain measurement; peeling algorithm; Ceramics; Deconvolution; Electronics packaging; Heuristic algorithms; High-speed electronics; Integrated circuit interconnections; Nonhomogeneous media; Time domain analysis; Vehicle dynamics; Vehicles;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.486484

Filename

486484