• DocumentCode
    768083
  • Title

    Efficient transient simulation of lossy packaging interconnects using moment-matching techniques

  • Author

    Celik, Mustafa ; Cangellaris, Andreas C.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
  • Volume
    19
  • Issue
    1
  • fYear
    1996
  • fDate
    2/1/1996 12:00:00 AM
  • Firstpage
    64
  • Lastpage
    73
  • Abstract
    This paper introduces enhancements to moment-matching techniques for rapid time-domain computer simulation of packaging interconnect structures. New moment calculating methods are proposed to handle dispersive, lossy interconnects and related package discontinuities, transitions and junctions that are modeled in terms of either numerically extracted or measured frequency-dependent, equivalent transmission line parameters, or scattering parameters. Computer simulations of pulse propagation in interconnects with frequency-dependent ohmic losses are used to demonstrate the validity and accuracy of the proposed methods
  • Keywords
    S-parameters; circuit analysis computing; equivalent circuits; integrated circuit interconnections; integrated circuit packaging; method of moments; transient analysis; discontinuities; dispersive lossy packaging interconnects; frequency-dependent equivalent transmission line parameters; junctions; moment-matching techniques; ohmic losses; pulse propagation; scattering parameters; time-domain computer simulation; transient simulation; transitions; Computational modeling; Computer simulation; Dispersion; Frequency; Packaging; Power system transients; Propagation losses; Time domain analysis; Transmission line discontinuities; Transmission line measurements;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9894
  • Type

    jour

  • DOI
    10.1109/96.486486
  • Filename
    486486