DocumentCode :
768811
Title :
Foreword Advanced Interconnects and Materials
Author :
Segelken, J.M.
Volume :
19
Issue :
1
fYear :
1996
fDate :
3/1/1996 12:00:00 AM
Firstpage :
4
Keywords :
Consumer electronics; Costs; Electronic components; Electronics packaging; Laboratories; Materials reliability; Optical interconnections; Paper technology; Telephony;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9886
Type :
jour
DOI :
10.1109/TCPMA.1996.486554
Filename :
486554
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=768811
