Characteristics and potential application of polyimide-core-bump to flip chip

Author

Nishimori, Takashi ; Yanagihara, Hiroshi ; Murayama, Keiji ; Kama, Yasunori ; Nakamura, Misa

Author_Institution

Isehara Works, Tanaka Kikinzoka Kogyo K.K., Kanagawa, Japan

Volume

19

Issue

1

fYear

1996

fDate

3/1/1996 12:00:00 AM

Firstpage

18

Lastpage

23

Abstract

Polyimide core bumps are formed by following these steps: first, forming polyimide cores using photosensitive polyimide, next, metallization on the polyimide cores by sputtering, and finally, patterning the metallized layers. The polyimide core bumps thus prepared have the advantages of larger aspect ratios, and better bump height uniformity without conventional levelling process, and larger elasticity compared with solid metal bumps such as gold or solder. Also various bonding methods are applicable as solderings, or gold-tin bonding with pressure and adhering, or other mechanical contact with adhesive

Keywords

flip-chip devices; integrated circuit interconnections; integrated circuit packaging; sputtering; IC interconnections; aspect ratios; bonding methods; bump height uniformity; elasticity; flip chip; mechanical contact; metallization; photosensitive polyimide; polyimide-core-bump; sputtering; Bonding; Coatings; Elasticity; Flip chip; Gold; Metallization; Passivation; Polyimides; Sputter etching; Sputtering;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.486557

Filename

486557