DocumentCode
769587
Title
Experimental characterization of transmission lines in thin-film multichip modules
Author
Lipa, Steven ; Steer, Michael B. ; Cangellaris, Andreas C. ; Franzon, Paul D.
Author_Institution
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Volume
19
Issue
1
fYear
1996
fDate
3/1/1996 12:00:00 AM
Firstpage
122
Lastpage
126
Abstract
Signal propagation on transmission lines fabricated in thin polyimide films on silicon substrates is investigated. Series resistive and shunt conductive losses are separated and it is shown that the effective dielectric loss is much higher than that expected from bulk material properties
Keywords
dielectric losses; microstrip lines; multichip modules; polymer films; strip lines; effective dielectric loss; lossy transmission lines; series resistive losses; shunt conductive losses; signal propagation; thin polyimide films; thin-film multichip modules; transmission line characterisation; Conductive films; Dielectric losses; Dielectric substrates; Dielectric thin films; Material properties; Polyimides; Semiconductor films; Silicon; Transistors; Transmission lines;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher
ieee
ISSN
1070-9886
Type
jour
DOI
10.1109/95.486623
Filename
486623
Link To Document