Mechanical response of PCB assemblies during infrared reflow soldering

Author

Mittal, Sandeep ; Masada, Glenn Y. ; Bergman, Theodore L.

Author_Institution

Dept. of Mech. Eng., Texas Univ., Austin, TX, USA

Volume

19

Issue

1

fYear

1996

fDate

3/1/1996 12:00:00 AM

Firstpage

127

Lastpage

133

Abstract

A finite element structural model is developed to predict the thermomechanical behavior of printed circuit board (PCB) assemblies during infrared reflow soldering. Specifically, the model predicts the amount of board warpage, the effects of increased PCB assembly stiffness resulting from the solder joint formation, and the size of gaps generated at the module lead solder pad interface. In this paper, quantitative estimates of these process-induced variables are provided as well as a description of the approach used for the analyses

Keywords

assembling; finite element analysis; printed circuit manufacture; reflow soldering; PCB assemblies; board warpage; finite element structural model; infrared reflow soldering; mechanical response; process-induced variables; solder joint formation; solder pad interface; stiffness; thermomechanical behavior; Assembly; Copper; Lead; Packaging; Printed circuits; Reflow soldering; Semiconductor device modeling; Temperature; Thermal stresses; Thermomechanical processes;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.486624

Filename

486624