DocumentCode
772403
Title
An integrated LTCC laminated waveguide-to-microstrip line T-junction
Author
Huang, Yong ; Wu, Ke-Li ; Ehlert, Michael
Author_Institution
Dept. of Electron. Eng., City Univ. of Hong Kong, China
Volume
13
Issue
8
fYear
2003
Firstpage
338
Lastpage
339
Abstract
In this paper, an integrated low-temperature co-fired ceramic (LTCC) laminated waveguide to microstrip line T-junction is proposed and experimentally verified. A multilayer bell-shape probe end comprising multiple parallel metallic pads is used to improve the bandwidth and matching condition. The experimental result shows good correlation with the simulated result. The configuration can also be used as the transition between microstrip line and laminated waveguide.
Keywords
antenna feeds; ceramic packaging; laminates; microstrip antenna arrays; substrates; waveguide junctions; LMDS frequency band; bandwidth; integrated LTCC laminated waveguide; integrated modules; matching condition; multilayer bell-shape probe end; multiple parallel metallic pads; waveguide to microstrip line T-junction; Antenna arrays; Bandwidth; Ceramics; Microstrip antenna arrays; Microstrip antennas; Patch antennas; Planar waveguides; Probes; Waveguide components; Waveguide transitions;
fLanguage
English
Journal_Title
Microwave and Wireless Components Letters, IEEE
Publisher
ieee
ISSN
1531-1309
Type
jour
DOI
10.1109/LMWC.2003.815690
Filename
1225676
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