Title :
An integrated LTCC laminated waveguide-to-microstrip line T-junction
Author :
Huang, Yong ; Wu, Ke-Li ; Ehlert, Michael
Author_Institution :
Dept. of Electron. Eng., City Univ. of Hong Kong, China
Abstract :
In this paper, an integrated low-temperature co-fired ceramic (LTCC) laminated waveguide to microstrip line T-junction is proposed and experimentally verified. A multilayer bell-shape probe end comprising multiple parallel metallic pads is used to improve the bandwidth and matching condition. The experimental result shows good correlation with the simulated result. The configuration can also be used as the transition between microstrip line and laminated waveguide.
Keywords :
antenna feeds; ceramic packaging; laminates; microstrip antenna arrays; substrates; waveguide junctions; LMDS frequency band; bandwidth; integrated LTCC laminated waveguide; integrated modules; matching condition; multilayer bell-shape probe end; multiple parallel metallic pads; waveguide to microstrip line T-junction; Antenna arrays; Bandwidth; Ceramics; Microstrip antenna arrays; Microstrip antennas; Patch antennas; Planar waveguides; Probes; Waveguide components; Waveguide transitions;
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2003.815690
