• DocumentCode
    773090
  • Title

    Overview of Solid-State Thermoelectric Refrigerators and Possible Applications to On-Chip Thermal Management

  • Author

    Sharp, Jeff ; Bierschenk, Jim ; Lyon, Hylan B., Jr.

  • Author_Institution
    Marlow industries, Inc, Dallas, TX
  • Volume
    94
  • Issue
    8
  • fYear
    2006
  • Firstpage
    1602
  • Lastpage
    1612
  • Abstract
    The concept of thermal management in microelectronic components is changing, and so is the potential for solid-state cooling to solve emerging problems. There is a qualitative change that differentiates the past from the future. We discuss past practices and future trends in the electronic cooling markets, setting the stage for an outline of designs and processes that provide new and enabling options. We briefly review the science that is empowering these changes, and conclude with some thoughts on the future direction of thermal management of microelectronics
  • Keywords
    cooling; integrated circuit packaging; refrigerators; thermal management (packaging); thermoelectric devices; electronic cooling markets; microelectronic components; on-chip thermal management; solid-state cooling; solid-state thermoelectric refrigerators; Cooling; Heat pumps; Heat sinks; Refrigerators; Resistance heating; Solid state circuits; Tellurium; Thermal management; Thermal resistance; Thermoelectricity; Chip cooling; coefficient of performance (COP); heat sinking; heat spreading; solid-state cooling; spot cooling; thermal management; thermoelectric;
  • fLanguage
    English
  • Journal_Title
    Proceedings of the IEEE
  • Publisher
    ieee
  • ISSN
    0018-9219
  • Type

    jour

  • DOI
    10.1109/JPROC.2006.879795
  • Filename
    1705145