DocumentCode :
773090
Title :
Overview of Solid-State Thermoelectric Refrigerators and Possible Applications to On-Chip Thermal Management
Author :
Sharp, Jeff ; Bierschenk, Jim ; Lyon, Hylan B., Jr.
Author_Institution :
Marlow industries, Inc, Dallas, TX
Volume :
94
Issue :
8
fYear :
2006
Firstpage :
1602
Lastpage :
1612
Abstract :
The concept of thermal management in microelectronic components is changing, and so is the potential for solid-state cooling to solve emerging problems. There is a qualitative change that differentiates the past from the future. We discuss past practices and future trends in the electronic cooling markets, setting the stage for an outline of designs and processes that provide new and enabling options. We briefly review the science that is empowering these changes, and conclude with some thoughts on the future direction of thermal management of microelectronics
Keywords :
cooling; integrated circuit packaging; refrigerators; thermal management (packaging); thermoelectric devices; electronic cooling markets; microelectronic components; on-chip thermal management; solid-state cooling; solid-state thermoelectric refrigerators; Cooling; Heat pumps; Heat sinks; Refrigerators; Resistance heating; Solid state circuits; Tellurium; Thermal management; Thermal resistance; Thermoelectricity; Chip cooling; coefficient of performance (COP); heat sinking; heat spreading; solid-state cooling; spot cooling; thermal management; thermoelectric;
fLanguage :
English
Journal_Title :
Proceedings of the IEEE
Publisher :
ieee
ISSN :
0018-9219
Type :
jour
DOI :
10.1109/JPROC.2006.879795
Filename :
1705145
Link To Document :
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