• DocumentCode
    773452
  • Title

    Partnerships take the lead: a deans summit on education for a technological world

  • Author

    Sechrist, Chalmers F. ; Batchman, Ted E. ; Feisel, Lyle D. ; Gmelch, Walter H. ; Gorham, Douglas ; Stoler, Barbara C.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
  • Volume
    45
  • Issue
    2
  • fYear
    2002
  • fDate
    5/1/2002 12:00:00 AM
  • Firstpage
    118
  • Lastpage
    127
  • Abstract
    There is much concern about graduates from the US precollege (K-12) system being technologically literate enough to survive in our modern, rapidly changing technological world. Through the sponsorship of the IEEE Educational Activities Board, a Summit of Deans of Education and Deans of Engineering was convened to address the issues of technological literacy. Forty-two pairs of deans began cross-campus collaborations at the summit, held October 1-2, 2001, in Baltimore, MD. The conference comprised keynote speakers, panel sessions, a poster session, and breakout groups that brainstormed to develop common or emerging themes and action plans. Each pair of deans committed to a customized action plan to guide their future collaborations in the contexts of precollege (K-12) teacher preparation, outreach, and the enhancement of engineering teaching, learning, and assessment. This paper summarizes the conference and the action items suggested by these deans
  • Keywords
    educational courses; engineering education; teaching; Deans Summit; IEEE Educational Activities Board; K-12; cross-campus collaborations; engineering education; precollege education; teacher preparation; technological literacy; Africa; Collaboration; Computer science education; Educational Activities Board; Educational activities; Educational technology; Food technology; Helium; Meeting planning; Paper technology;
  • fLanguage
    English
  • Journal_Title
    Education, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9359
  • Type

    jour

  • DOI
    10.1109/TE.2002.1013875
  • Filename
    1013875