• DocumentCode
    773947
  • Title

    SILC effects on E2PROM memory cell reliability

  • Author

    Larcher, Luca ; Bertulu, Salvatore ; Pavan, Paolo

  • Author_Institution
    DISMI & INFM, Univ. di Modena a Reggio Emilia, Italy
  • Volume
    2
  • Issue
    1
  • fYear
    2002
  • fDate
    3/1/2002 12:00:00 AM
  • Firstpage
    13
  • Lastpage
    18
  • Abstract
    In this paper, we will investigate SILC effects on the reliability of E2PROM memories. Particularly, we will analyze the influence on the retention properties of E2PROM memory devices of program/erase number of cycles and bias conditions, oxide thickness scaling and quality, and storage field. To accomplish this task, we will use a recently proposed compact E2PROM model, which has been extended to include the stress-induced leakage current (SILC), thus bridging the gap between the oxide quality characterization activity performed on MOS transistors and capacitors, and the actual impact of SILC on the functioning of E2PROM memories
  • Keywords
    EPROM; integrated circuit modelling; integrated circuit reliability; leakage currents; tunnelling; E2PROM memories; Fowler-Nordheim expression; bias conditions; compact model; excess low field current; floating-gate memory cells; integrated circuit reliability; lumped element model; memory cell reliability; oxide quality; oxide reliability; oxide thickness scaling; program/erase number of cycles; read disturbs; retention properties; storage field; stress-induced leakage current effects; tunnel currents; Character generation; Charge measurement; Current measurement; Degradation; PROM; Quantization; Random access memory; Solid modeling; Stress; Threshold voltage;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2002.1014668
  • Filename
    1014668