Quality and reliability impact of defect data analysis

Author

Bruls, Eric

Author_Institution

Philips Res. Labs., Eindhoven, Netherlands

Volume

8

Issue

2

fYear

1995

fDate

5/1/1995 12:00:00 AM

Firstpage

121

Lastpage

129

Abstract

In the last decade we have seen a shift towards a broader application of information on IC manufacturing defects. Here an overview is given of the methods used to gather data on the defects with a focus on local defects in the interconnection layers. Next this information is applied to determine a model describing the geometrical aspects of such defects. This model is used to arrive at a definition of hard faults and soft faults and to derive a relationship between the relative number of occurrence for either fault. Because the electrical impact of some of the soft faults will be closely related to the behavior of small open circuits or gate-oxide shorts, this relationship is an indication for the extent of the quality and reliability problems

Keywords

fault diagnosis; integrated circuit interconnections; integrated circuit manufacture; integrated circuit modelling; integrated circuit reliability; monitoring; quality control; IC manufacturing defects; defect data analysis; gate-oxide shorts; geometrical aspects; hard faults; interconnection layers; local defects; model; open circuits; reliability; soft faults; Application specific integrated circuits; Circuit faults; Circuit testing; Data analysis; Integrated circuit interconnections; Integrated circuit testing; Manufacturing; Process design; Production; Solid modeling;

fLanguage

English

Journal_Title

Semiconductor Manufacturing, IEEE Transactions on

Publisher

ieee

ISSN

0894-6507

Type

jour

DOI

10.1109/66.382275

Filename

382275