DocumentCode
776241
Title
Through-silicon-chip transmission lines
Author
Ng, K.T. ; Boellaard, E. ; Pham, N.P. ; Burghartz, J.N.
Author_Institution
Delft Inst. of Microelectron. & Submicron Technol., Delft Univ. of Technol., Netherlands
Volume
38
Issue
13
fYear
2002
fDate
6/20/2002 12:00:00 AM
Firstpage
640
Lastpage
641
Abstract
Through-chip transmission lines connecting the frontside and backside of high-resistivity wafers are fabricated using bulk-micromachining and backside metal patterning. Experimental results illustrate the feasibility of low-loss through-chip microstrips and coplanar waveguides for innovative integration concepts of radio-frequency and microwave systems in silicon technology
Keywords
coplanar waveguides; micromachining; microstrip lines; Si; backside; backside metal patterning; bulk-micromachining; coplanar waveguides; frontside; high-resistivity wafers; microstrips; microwave systems; radio-frequency systems; through-silicon-chip transmission lines;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:20020430
Filename
1015731
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