• DocumentCode
    77651
  • Title

    Analysis of Charge Deposition and Collection Caused by Low Energy Neutrons in a 25-nm Bulk CMOS Technology

  • Author

    Abe, Shin-ichiro ; Watanabe, Yoshihiro

  • Author_Institution
    Dept. of Adv. Energy Eng., Kyushu Univ., Fukuoka, Japan
  • Volume
    61
  • Issue
    6
  • fYear
    2014
  • fDate
    Dec. 2014
  • Firstpage
    3519
  • Lastpage
    3526
  • Abstract
    Neutron-induced single event upsets (SEUs) in a 25-nm NMOSFET are analyzed using PHYSERD simulation. We confirm that the secondary H and He ions dominate SEUs above the threshold energies of (n,p) and ( n, α) reactions although the production cross sections for H and He ions are smaller than the elastic scattering cross sections below 20 MeV. The SEUs induced by secondary H and He ions are influenced strongly by the size of the interaction volume considered in the simulation because the ranges of H and He ions are much longer than those of elastic recoils.
  • Keywords
    MOSFET; Monte Carlo methods; neutron effects; radiation hardening (electronics); semiconductor device models; ( n,α) reactions; (n,p) reactions; 25-nm NMOSFET; PHYSERD simulation; bulk CMOS technology; charge deposition analysis; elastic recoils; elastic scattering cross sections; interaction volume size; low energy neutrons; neutron-induced single event upsets; production cross sections; secondary H ions; secondary He ions; threshold energies; CMOS technology; MOSFET circuits; Monte Carlo methods; Neutrons; Radiation effects; Single event upsets; Monte Carlo simulation; PHYSERD; neutrons; single event upset (SEU); terrestrial radiation effects;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.2014.2367513
  • Filename
    6975251