• DocumentCode
    776833
  • Title

    Thermal-ADI - a linear-time chip-level dynamic thermal-simulation algorithm based on alternating-direction-implicit (ADI) method

  • Author

    Wang, Ting-Yuan ; Chen, Charlie Chung-Ping

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Wisconsin, Madison, WI, USA
  • Volume
    11
  • Issue
    4
  • fYear
    2003
  • Firstpage
    691
  • Lastpage
    700
  • Abstract
    Due to the dramatic increase of clock frequency and integration density, power density and on-chip temperature in high-end very large scale integration (VLSI) circuits rise significantly. To ensure the timing correctness and the reliability of high-end VLSI design, efficient and accurate chip-level transient thermal simulations are of crucial importance. In this paper, we develop and present an efficient transient thermal-simulation algorithm based on the alternating-direction-implicit (ADI) method. Our algorithm, thermal-ADI, not only has a linear run time and memory requirement , but is also unconditionally stable, which ensures that time step is not limited by any stability requirement. Extensive experimental results show that our algorithm is not only orders of magnitude faster than the traditional thermal-simulation algorithms, but also highly accurate and efficient in memory usage.
  • Keywords
    circuit simulation; integrated circuit modelling; integrated circuit reliability; thermal analysis; timing; transient analysis; alternating-direction-implicit method; chip-level transient thermal simulations; clock frequency; integration density; linear run time; linear-time chip-level dynamic thermal-simulation algorithm; memory requirement; memory usage; on-chip temperature; power density; reliability; thermal-ADI; time step; timing correctness; Circuit simulation; Clocks; Frequency; Heuristic algorithms; Integrated circuit reliability; Temperature; Thermal stability; Timing; VHF circuits; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2003.812372
  • Filename
    1229875