Multichip modules: next-generation packages

Author

Johnson, Robert R.

Author_Institution

Dept. of Comput. Sci., Utah Univ., Salt Lake City, UT, USA

Volume

27

Issue

3

fYear

1990

fDate

3/1/1990 12:00:00 AM

Firstpage

34

Lastpage

36

Abstract

Multichip modules (MCMs), which interconnect multiple bare dice by means of a stack of conductive and dielectric thin films, are discussed. Among their advantages are reduced delays between chips, simplified power distribution, and enhanced dissipation capabilities. Key design demands that should be weighed by IC design engineers planning to use MCMs are examined. They concern transmission delays, power distribution, heat dissipation, and temperature, as well as testing, burn-in, and rework. The various approaches to MCM packages are described. Factory-programmable versus user-programmable options are considered. Techniques for connecting chips to substrates are discussed.<>

Keywords

hybrid integrated circuits; integrated circuit technology; modules; packaging; printed circuits; MCMs; burn-in; conductive thin films; dielectric thin films; heat dissipation; multichip modules; power distribution; rework; testing; transmission delays; Delay; Design engineering; Dielectric thin films; Joining processes; Multichip modules; Packaging; Power distribution; Power engineering and energy; Temperature distribution; Testing;

fLanguage

English

Journal_Title

Spectrum, IEEE

Publisher

ieee

ISSN

0018-9235

Type

jour

DOI

10.1109/6.48848

Filename

48848