Title :
Improved Interfacial and Electrical Properties of Ge-Based Metal-Oxide-Semiconductor Capacitor With LaTaON Passivation Layer
Author :
Feng Ji ; Jing-Ping Xu ; Yong Huang ; Lu Liu ; Lai, P.T.
Author_Institution :
Wuhan Polytech., Wuhan, China
Abstract :
The interfacial and electrical properties of Ge-based metal-oxide-semiconductor (MOS) capacitor with high-k gate dielectric of HfTiO and passivation interlayer of LaTaON are investigated. Experimental results show the Ge MOS with HfTiO/LaTaON gate-stacked dielectric exhibits low interface-state density (7.8 × 1011 cm-2 eV-1), small gate-leakage current (7.88 × 10-4 A cm-2 at Vg - Vfb = 1 V), small capacitance equivalent thickness (1.1 nm), and large equivalent dielectric constant (27.7). X-ray photoelectron spectroscopy and transmission electron microscopy reveal that the improvements should be due to the fact that La/Ta-based oxide/oxynitride has excellent interface properties with Ge, and the LaTaON interlayer can effectively block the in-diffusion of oxygen and the out-diffusion of germanium, thus suppressing the growth of low-k GeOx and intermixing between Ge and Hf.
Keywords :
MOS capacitors; X-ray photoelectron spectra; elemental semiconductors; germanium; hafnium compounds; high-k dielectric thin films; lanthanum compounds; passivation; tantalum compounds; titanium compounds; transmission electron microscopy; Ge; Ge-based MOS capacitor; Ge-based metal-oxide-semiconductor capacitor; HfTiO; HfTiO-LaTaON gate-stacked dielectric; La-Ta-based oxide-oxynitride; LaTaON; X-ray photoelectron spectroscopy; electrical properties; high-k gate dielectric; interfacial properties; passivation interlayer; size 11 nm; transmission electron microscopy; Dielectrics; Educational institutions; Germanium; Hafnium; High K dielectric materials; Logic gates; Passivation; Ge metal–oxide–semiconductor (Ge MOS); Ge metal??oxide??semiconductor (Ge MOS); LaTaON; LaTaOn; high- (k) dielectric; high-k dielectric; interface properties; passivation Layer; passivation layer;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2014.2356597