Title :
Application of defected ground structure in reducing the size of amplifiers
Author :
Lim, Jong-Sik ; Park, Jun-Seok ; Lee, Young-Taek ; Ahn, Dal ; Nam, Sangwook
Author_Institution :
Appl. Electromagn. Lab., Seoul Nat. Univ., South Korea
fDate :
7/1/2002 12:00:00 AM
Abstract :
This letter presents a new technique to reduce the size of microwave amplifiers using a defected ground structure (DGS). The DGS on the ground plane of a microstrip line provides an additional effective inductive component, which enables a microstrip line with very high impedance to be realized and shows slow-wave characteristics. The resultant electrical length of the microstrip line with DGS is longer than that of a conventional line for the same physical length. Therefore, the microstrip line with DGS can be shortened in order to maintain the same electrical length, matching, and performances of the basic (original) amplifier. To confirm the validity of this idea, two amplifiers, one of which is designed using a conventional microstrip line and the other is reduced using DGS, are fabricated, measured, and compared. The performance of the reduced amplifier with DGS is quite similar to that of the basic amplifier, even though the series microstrip lines with DGS are much smaller than those of the basic amplifier by 53.8% and 55.6% at input and output matching networks, respectively.
Keywords :
HEMT circuits; impedance matching; microstrip circuits; microstrip lines; microwave amplifiers; periodic structures; slow wave structures; defected ground structure; effective inductive component; general purpose HEMT device amplifier; input matching networks; microstrip line electrical length; microstrip line ground plane; microwave amplifiers; output matching networks; periodic structures; size reduction; slow-wave characteristics; very high impedance microstrip line; Associate members; Dielectric substrates; Distributed amplifiers; Impedance matching; Microstrip components; Microwave amplifiers; Microwave theory and techniques; Performance evaluation; Periodic structures; Power transmission lines;
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2002.801139