Title :
Guided-wave characteristics of periodically nonuniform coupled microstrip lines-even and odd modes
Author :
Sun, Sheng ; Zhu, Lei
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
fDate :
4/1/2005 12:00:00 AM
Abstract :
Even- and odd-mode guided-wave characteristics of periodically nonuniform coupled microstrip lines (PNCML) are thoroughly investigated in terms of the two sets of per-unit-length transmission parameters, i.e., characteristic impedance and phase constant. By executing the short-open calibration (SOC) procedure in the method-of-moments platform, the two-port ABCD matrices of the PNCML with finite unit cells are numerically deembedded via two sets of SOC standards so as to explicitly derive the effective per-unit-length parameters. After our investigation on the behaviors of numerical convergence, extensive results are derived to demonstrate the frequency- and periodicity-dependent per-unit-length parameters of the three types of PNCML against those of the uniform coupled microstrip line. In final, the S-parameters of a PNCML circuit are directly simulated via extracted per-unit-length parameters and they are validated in magnitude and phase by those from the Momentum simulator.
Keywords :
S-parameters; coupled transmission lines; method of moments; microstrip lines; ABCD matrices; S-parameters; SOC standards; characteristic impedance; guided wave characteristic; method-of-moments platform; momentum simulator; numerical convergence; periodically nonuniform coupled microstrip lines; phase constant; short-open calibration; transmission parameters; Calibration; Circuit simulation; Convergence of numerical methods; Coupling circuits; Frequency; Impedance; Microstrip; Moment methods; Scattering parameters; Transmission line matrix methods; Even mode; method of moments (MoM); odd mode; per-unit-length transmission parameters; periodically nonuniform coupled microstrip line (PNCML); short-open calibration (SOC);
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
DOI :
10.1109/TMTT.2005.845709