Title :
Tutorial: temperature as an input to microelectronics-reliability models
Author_Institution :
Motorola Inc., Plantation, FL, USA
fDate :
3/1/1996 12:00:00 AM
Abstract :
This tutorial discusses various modeling methodologies for temperature acceleration of microelectronic-device failures; there are situations in which some methodologies give-misleading results. The aim is to raise the level of understanding of the impact of temperature on reliability and to define the objectives of physics-based temperature modeling. There are alternatives to both the Arrhenius relation and the MilHdbk-217 approach to reliability. In Japan, Taiwan, Singapore, and Malaysia, a physics-of-failure approach is used by most companies. Philips in the Netherlands and the CADMP Alliance in the USA have developed methods and software to conduct physics-based reliability assessments
Keywords :
failure analysis; integrated circuit modelling; integrated circuit reliability; reliability theory; Arrhenius relation; CADMP Alliance; Japan; Malaysia; MilHdbk-217; Singapore; Taiwan; activation energy; mean time to failure; microelectronic-device failures; microelectronics-reliability models; physics-based temperature modeling; physics-of-failure; reliability assessments; reliability prediction; temperature accelerated failures; Acceleration; Electronic equipment; Electrostatic discharge; Failure analysis; Integrated circuit reliability; Microelectronics; Stress; Temperature; Threshold voltage; Tutorial;
Journal_Title :
Reliability, IEEE Transactions on