Title :
Novel LTCC Distributed-Element Wideband Bandpass Filter Based on the Dual-Mode Stepped-Impedance Resonator
Author :
Jian-Xin Chen ; Yang Zhan ; Quan Xue
Author_Institution :
Sch. of Electron. & Inf., Nantong Univ., Nantong, China
Abstract :
In this paper, a novel compact 3-D dual-mode stepped-impedance resonator (SIR) with centrally loaded stub is constructed for designing a wideband low-temperature cofired ceramic (LTCC) bandpass filter (BPF). By fully taking advantage of the LTCC technology, the dual-mode SIR, as a cell unit of the proposed filter, is reasonably folded in 3-D environment, and its properties are investigated using the transmission line theory. Accordingly, benefiting from the 3-D circuit layout, the proposed BPF designed by combining the SIR and dual-mode techniques can effectively overcome a vital and common drawback of large circuit size of the LTCC distributed-element filters. For demonstration, a fourth-order wideband BPF centered at 5 GHz is designed, fabricated, and measured. The circuit size of the designed BPF has a compact size of 3.875 × 4.8 × 1.4 mm3. The impact of the package on the coupling and routing scheme and frequency response/transmission zero has been analyzed and demonstrated. The simulated and measured results are presented and compared, showing a good agreement.
Keywords :
band-pass filters; ceramic packaging; network routing; transmission line theory; 3-D circuit layout; 3-D environment; LTCC distributed-element wideband bandpass filter; centrally loaded stub; circuit size; compact 3-D dual-mode stepped-impedance resonator; frequency 5 GHz; frequency response; routing scheme; transmission line theory; transmission zero; Band-pass filters; Couplings; Filtering theory; Impedance; Stripline; Transmission line matrix methods; Wideband; Dual-mode stepped-impedance resonator (SIR); low-temperature cofired ceramic (LTCC); miniaturization; transmission zero; wideband bandpass filter (BPF); wideband bandpass filter (BPF).;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2015.2401023