Title :
A full-wave model for EMI prediction in planar microstrip circuits excited in the near-field of a short electric dipole
Author :
Bernardi, Paolo ; Cicchetti, Renato ; Moreolo, Delio Svaluto
Author_Institution :
Dipartimento di Ingegneria Elettronica, La Sapienza Univ., Rome, Italy
fDate :
5/1/1995 12:00:00 AM
Abstract :
A full-wave model to evaluate the interference induced in planar microstrip lines of arbitrary shape exposed to the near-field of an elementary electric dipole is presented. The analysis of the line response, consisting in the evaluation of the surface current excited along the microstrip line, is based on the electric dyadic Green´s function method. The surface current induced on the metal strip which, for the sake of generality, is considered as embedded in the dielectric substrate, is obtained solving by means of the spectral-domain approach (SDA) the electric integral equation, which enforces the boundary condition of zero tangential electric field on the surface of the strip. The induced current is computed for different line geometries and loads, and for various positions (inside or outside the dielectric substrate) and orientations of the dipolar source. Indications towards reducing the level of the signal induced on the loads of the line are inferred
Keywords :
Green´s function methods; boundary integral equations; electric current; electric fields; electromagnetic interference; microstrip circuits; microstrip lines; spectral-domain analysis; EMI prediction; boundary condition; dielectric substrate; electric dyadic Green´s function method; electric integral equation; full-wave model; induced current; interference; line geometries; line response; loads; metal strip; near-field; orientations; planar microstrip circuits; short electric dipole; spectral-domain approach; surface current; zero tangential electric field; Boundary conditions; Circuits; Dielectric substrates; Electromagnetic interference; Green´s function methods; Integral equations; Microstrip; Predictive models; Shape; Strips;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on