• DocumentCode
    780122
  • Title

    Foreword contributions from the 51st electronic components and technology conference

  • Author

    Caggiano, Michael

  • Author_Institution
    Rutgers University
  • Volume
    25
  • Issue
    1
  • fYear
    2002
  • Firstpage
    3
  • Lastpage
    3
  • Keywords
    Aerospace electronics; Circuit simulation; Clocks; Electronic components; Electronics packaging; Paper technology; Printed circuits; RF signals; Radio frequency; Wafer scale integration;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2002.1017677
  • Filename
    1017677