DocumentCode
780122
Title
Foreword contributions from the 51st electronic components and technology conference
Author
Caggiano, Michael
Author_Institution
Rutgers University
Volume
25
Issue
1
fYear
2002
Firstpage
3
Lastpage
3
Keywords
Aerospace electronics; Circuit simulation; Clocks; Electronic components; Electronics packaging; Paper technology; Printed circuits; RF signals; Radio frequency; Wafer scale integration;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2002.1017677
Filename
1017677
Link To Document