Title :
A quasi three-dimensional distributed electromagnetic model for complex power distribution networks
Author :
Choi, Myoung Joon ; Cangellaris, Andreas C.
Author_Institution :
Illinois Univ., Urbana, IL, USA
fDate :
2/1/2002 12:00:00 AM
Abstract :
This paper describes a systematic methodology for the electromagnetic modeling of complex power distribution networks. The proposed methodology uses locally three-dimensional (3D) modifications to an otherwise two-dimensional (2D) description of the behavior of electromagnetic fields between power/ground plane pairs, to model correctly the field behavior at discontinuities such as vias, pins, and splits in the power/ground plane structure. Furthermore, a systematic synthesis methodology is presented for the direct generation of a SPICE-compatible multiport macro-model for the power distribution network from its discrete quasi 3D model. The proposed modeling and equivalent circuit synthesis methodologies are validated through a specific numerical simulation study of the transient electromagnetic analysis of a power/ground plane pair during switching
Keywords :
SPICE; circuit complexity; circuit noise; electromagnetic field theory; equivalent circuits; network analysis; numerical analysis; packaging; power supply circuits; 2D electromagnetic field; SPICE-compatible multiport macro-model; complex power distribution networks; discontinuities; discrete quasi 3D model; electromagnetic field behavior model; electromagnetic modeling; equivalent circuit synthesis; locally 3D modifications; modeling; numerical simulation; pins; power/ground plane pairs; power/ground plane structure splits; quasi-3D distributed electromagnetic model; simultaneous switching noise; switching; systematic synthesis methodology; transient electromagnetic analysis; vias; Circuit synthesis; Electromagnetic fields; Electromagnetic modeling; Equivalent circuits; Network synthesis; Numerical simulation; Pins; Power generation; Power system modeling; Power systems;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2002.1017681