Title :
Half-conductive coupling interconnection technology for digital transmission between CMOS chips
Author :
Devisch, Frédéric ; Maillard, Xavier ; Pan, Wei ; De Tandt, C. ; Vounckx, Roger ; Kuijk, Maarten
Author_Institution :
Vrije Univ., Brussels, Belgium
fDate :
2/1/2002 12:00:00 AM
Abstract :
This paper describes how to use half-conductive coupling (HC-coupling) to obtain digital interconnections between two flip-chip standard CMOS integrated circuits. For process simplicity, the HC-layer can be unpatterned and the CMOS chips do not require any post-processing steps. Measurements of a complete HC-coupling, digital communication link show reliable operation up to 100 Mb/s channel speed. The two flipped prototype CMOS chips were fabricated in 0.8-μm, 5-V CMOS. The I/O pads´ pitch was 150 μm
Keywords :
CMOS integrated circuits; crosstalk; flip-chip devices; integrated circuit interconnections; integrated circuit reliability; 0.8 micron; 100 Mbit/s; 150 micron; 5 V; CMOS chips; I/O pad pitch; channel speed; digital communication link; digital transmission; flip-chip standard CMOS integrated circuits; flipped prototype CMOS chips; half-conductive coupling interconnection technology; isolation ratio; reliable operation; CMOS integrated circuits; CMOS process; CMOS technology; Coupling circuits; Digital communication; Integrated circuit interconnections; Integrated circuit measurements; Integrated circuit technology; Semiconductor device measurement; Velocity measurement;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2002.1017690
