Title :
Automatic measurement system for degradation analysis in thin-film AlCu metallizations
Author :
Catelani, Marcantonio ; Nicoletti, Riccardo
Author_Institution :
Dipt. di Elettronica e Telecomunicazioni, Universita di Firenze, Florence, Italy
fDate :
6/1/2002 12:00:00 AM
Abstract :
Microelectronic devices are required to have high reliability when subjected to stresses within the maximum ratings. Nevertheless, in multilayered integrated circuits (ICs) several degradation phenomena can generate failures. In this paper, the degradation process in thin-film AlCu metallizations by means of the thermal stress test is taken into account. To this aim, an automatic measurement system with programmable performances is designed and realized in order to induce thermal degradation and compute data. The measurement system can be easily replicated with simple equipment and user-friendly LabView software
Keywords :
aluminium alloys; automatic test equipment; copper alloys; failure analysis; integrated circuit measurement; integrated circuit metallisation; integrated circuit reliability; thermal stresses; AlCu; AlCu thin film metallization; LabView software; automatic measurement system; degradation analysis; failure mechanism; microelectronic device; multilayered integrated circuit; programmable instrument; reliability; thermal stress test; Circuit testing; Integrated circuit measurements; Integrated circuit reliability; Metallization; Microelectronics; Performance evaluation; Thermal degradation; Thermal stresses; Thin film circuits; Transistors;
Journal_Title :
Instrumentation and Measurement, IEEE Transactions on
DOI :
10.1109/TIM.2002.1017707
