Title :
Impedance criterion for power modules comparison
Author :
Schanen, Jean-Luc ; Martin, Christian ; Frey, David ; Pasterczyk, Robert-J
Author_Institution :
Lab. d´´Electrotechnique de Grenoble, CNRS UMR, St. Martin d´´Heres, France
Abstract :
It is well known that power modules must exhibit as low as possible stray inductance. However, the total inductance of a power module is not the only parameter to indicate the electrical quality of the packaging. In this paper, mathematical criteria will be given, which will allow the evaluation of power modules interconnects with regard to several objectives: equal current constraints among the different paralleled dies, power-drive, and even drive-drive interactions.
Keywords :
driver circuits; drive-drive interactions; equal current constraints; impedance criterion; mathematical criteria; packaging electrical quality; parallel dies; power drives; power modules comparison; stray inductance; Conductors; Coupling circuits; Equivalent circuits; Impedance; Inductance; Insulated gate bipolar transistors; Integrated circuit interconnections; Multichip modules; Packaging; Solid modeling; Paralleling devices; parasitic impedance; power modules; power-drive interactions;
Journal_Title :
Power Electronics, IEEE Transactions on
DOI :
10.1109/TPEL.2005.861112