• DocumentCode
    781693
  • Title

    Fabrication of low loss polyimide optical waveguides using thin-film multichip module process technology

  • Author

    Beuhler, Allyson J. ; Wargowski, David A. ; Singer, Kenneth D. ; Kowalczyk, Tony

  • Author_Institution
    Amoco Chem. Co., Naperville, IL, USA
  • Volume
    18
  • Issue
    2
  • fYear
    1995
  • fDate
    5/1/1995 12:00:00 AM
  • Firstpage
    232
  • Lastpage
    234
  • Abstract
    A simple, wet chemical patterning process for the fabrication of low loss waveguides using photosensitive polyimides is described. Optically transparent, fluorinated polyimides are modified by co-polymerizing a low concentration of photocrosslinking groups into the backbone. The polyimides can then be patterned into arrays of channels, ribs, or Y branches, by UV exposure through a photomask followed by wet chemical development. Sidewall smoothness and sidewall profiles can be controlled by varying exposure and development conditions. The resulting polyimide waveguides are low loss and can be coupled into an optical fiber by end-fire coupling. Results on channel guide coupling, propagation, and loss are described
  • Keywords
    masks; optical fabrication; optical fibre couplers; optical losses; optical planar waveguides; photolithography; polymer films; UV exposure; Y branches; channel guide coupling; channels; copolymerization; development conditions; end-fire coupling; fluorinated polyimides; low loss optical waveguides; optical fiber; photocrosslinking groups; photomask; photosensitive polyimides; polyimide optical waveguides; process technology; ribs; sidewall profiles; sidewall smoothness; thin-film multichip module; wet chemical patterning process; Chemical processes; Optical coupling; Optical device fabrication; Optical fiber losses; Optical fibers; Optical losses; Optical waveguides; Polyimides; Ribs; Spine;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9894
  • Type

    jour

  • DOI
    10.1109/96.386246
  • Filename
    386246