Manufacturability of capacitively coupled multichip modules

Nearly all of the conductors interconnecting a die to a substrate can and should be replaced by capacitor junctions. Capacitive coupling is a new approach for mechanically and electrically packaging electronic modules, and provides order-of-magnitude decreases in manufacturing and repair costs, extremely tight junction pitch, lower power, higher speed, and much easier testing. In this paper, we review capacitive coupling and discuss novel issues of manufacturability and materials optimization for capacitively coupled electronic modules